Panafold at the 2018 TEI Conference
Panafold CEO Kit and CTO Meg traveled to Stockholm, Sweden to attend the Twelfth Annual Conference on Tangible, Embedded and Embodied Interaction. We promote designers from around the world here at Panafold (see our post on our trip to Norway and Denmark last year), and we have been TEI supporters since its beginning. We met and exchanged notes with designers and scientists from all over the world who were interested in craftsmanship and materials informed by digital technology. Some are calling this return to a physical relationship with materials the Post-Digital Era.
We were happy to be able to show some of our work in progress, and to be inspired by art, products, and user studies. The next TEI will be in Arizona with the theme “hybrid materials.”